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with an array of circular cross-section fins is used to cool a central processing the to ensure that the temperature of the CPU surface remains at Te-1000. is placed directly on the CPU with a special thermal paste. The associated contact resistance 8. (15 Marks) A heat sink unit (CPU) which dissipates a maximum of 1680 [W] in heat. The heat sink is l-pase T and is square in shape (WcrUry32 mm x 32mm). The temperature 25 C. The circular pin fins are arranged in a structured pattern (see Fig. 1). The spacing 10 [mm] thick of the fluid is To between The diameter of each of the fins is d 0.5 [mm), and the height of each fin heat sink is Ra-2x10-6 [ ]. WcPU Lf Lpase Rt.c 1708133 Fig. 1: (Left) Heat sink top view; (Right) Zoomed in heat sink top and side views Assume a convective heat transfer coefficient of h 2000 [mr] and a thermal conductivity of the metal of k - 500 Assume heat transfer only occurs through the heat sink (i.e, adiabatic boundary conditions at bottom and side of the CPU). For a circular fin efficiency, use the following tanh(mlc) mlc Where, Lc = Lf + d/4 and Af = PLC (e) (3 Marks) Draw a thermal circuit from the CPU surface to the fluid (include parallel resistances). (f) (7 Marks) Calculate each of the thermal resistances in the circuit in terms of the fin spacing parameter s (g) (5 Marks) Calculate the required fin spacing based on the given maximum heat transfer rate. PLEASE NOTE PARTS

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Siuen etat L base base Pbase abase 5Xto Reose- cl, 76 시03 KILj) IXID = Resistance 7s - = 2026 m mic Stt-. D.quR11. 8112 Rg fin ס 2.331 klo Re. Fi Abase Rtotal tta/100-10 3 ニ +1XIO2 Lothaut tins те-ть t -TL 0노 nd fjo ガの TC. Rhc) 100-Tb o 010736 tvtal 7b-loo - a,047

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