Question

a i 2 01- A 1.5 mm thin copper plate is sandwiched between two epoxy boards Apply the following data: k for epoxy 0.23 W/m·K: k for copper : 402 i) Identify the connection model of the thermal resistances then evaluate ii) Apply the analogy of Ohm-Law to determine the rate of heat transfer W/m.K, surface area-0.1 m the total resistance ii) Formulate then calculate the surface temperatures at both sides of the board. ISD Pointsl 、5mm

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T. ho 60 Wm2k 115mm k20 23 wimk Eqtialent Connection modols Nous, Total Resfstence 3 1시 5 cooxo 23 x ο 1 ー i 25χ0-1 ↑ 1000 xR 1.088443 k/w). (1)ans Paolo v-Yoltage R- Reslstance Sane for Heat Conduction wheseRThormal Resistane 41102 8 84443 Temperat

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