Question

-Step coverage is a unique feature in thermal evaporation that can be used for MEMS design. Please draw the metal deposited on the two devices below and indicate which one is better for the lift-off process. Arrows indicate the direction of the incoming evaporated metal. (3') ||||||||||| |||||||| PR PR SIO2 SiO2 si Si ) Which one is better for the lift-off process? (

Answer 1

I Si Diposited metal PR PR SiO2 SiO2 Si (Not beter) (better ) Reason:- (Fig. an (Fig. b) - During lift OFF process of sacrificial mtal. due to the shape of it having downward of craft in fig.b which makes easier for lift off and does not damages the target matesial. - Whereas in Fig. a due to shape of scacrificial mtot. in having draft out word which may cause domage to target omtal during lift off.