Question

1. Select all true statements about micromachining.

a. ion machining is a lithographic machining process.

b. a typical etch rate is 10 Angstroms/min

c. plasma etching is a "dry" etching process

d. HF is an isotropic etch agent on SiO2

e. sputter etching is like sand blasting at the micro level

f. REI uses ions with increased (more than plasma etching) energy

2. Select all true statements about nano and micro-machining background.

a.lab-on-a-chip devices are microfluidic devices

b. scaling laws explain why insects can fall from large heights without being damaged

c. size effects are unrelated to scaling laws

d. BOS units are orders of magnitude

e. an airplane and its parts have high tooling cost and low metrology cost

3. Select all true statements about vapor deposition.  

a. LPCVD has lower deposition rates than APCVD   

b. epitaxial growth is achieved through vapor deposition

c. PECVD generally has fewer impurities than LPCVD

d. evaporation is the main process used for deposition due to good step coverage

e. in PVD, ions are accelerated toward the wafer

4. Select all true statements about semiconductors and wafers.

a. silicon is very conductive at room temperature

b. phosphorus doping makes silicon negatively charged

c. a boule ground with two opposite flats is p-type

d. the unit for sheet resistance is the ohm

e. dry oxidation is often used to grow thicker oxides

f. a diode is like a light switch

Answer 1

I am pretty sure of the answers. Hope you thumpsup for the work. Thank you.

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