For the TSMC 0.18 μm process NMOS transistor, what are the following? TOX = 4.1 nm and the dielectric is SiO2.
a. Cox', fF/μm2
b. q∅s1, use the substrate doping Boron, 2.35e17 cm-3 (Hint: #10 of 09 Slides)
c. . q∅M, if the gate is aluminium (you will need to look this up)
d. q∅M, if the gate is poly, degeneratively doped with phosphorus, 5.02e20 cm-3
COx = (er * eo)/tox. ............(1)
Where er = 3.9 for SiO2
eo = 8.854 * 10-3
Substitute above values in the equation (1)
Cox = (8.854 * 10-3 * 3.9)/(4.1*10-9)
= 8.422 *10-3
= 0.008422 F/micro m2
For the TSMC 0.18 μm process NMOS transistor, what are the following? TOX = 4.1 nm and the dielec...
An n-channel Sí MOSFET (ni-1.5 1010 cm-3 ,er-11.8) with 50 nm thick HfO2 high- K dielectric (Er-25). The device width is W-10 m wide. The distance between the source and drain is L 0.5 μm long. The diffusion constant of the minority carriers in the channel at room temperature is 25 cm2/s. The n+ poly-Si gate is doped with Np 1020 cm-3 donors. This MOSFET is designed to have a threshold voltage of Vt 0.5 V. A gate-source voltage of...