100 um <110> 100 Hm anisotropically-etched cavity in silicon. The top surface of the wafer is <100. What is t...

Question

Question

100 um <110> 100 Hm anisotropically-etched cavity in silicon. The top surface of the wafer is <100. What is the size of the o

taking into account of lateral undercut underneath the original mask? Here, assume that the etch rate in the <111> direction

Answer 1

Answer #1

Col Surface1007 ToP min X 60pm/hy Sndirectio 14. 3 Hm/hY O5 Um min xbo Tolal ecb Yate - o 6t 0.05t 3 3.65 Hmhr wCize of 6T-3

Answer 2

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