4.12 Yaschchin (1995) discusses a process for the chemical etching of silicon wafers used in integrated...
1. The target thickness for silicon wafers used in a type of integrated circuit is 200 mm. A sample of 16 wafers is obtained and the thickness of each one is determined, resulting in a sample mean thickness of 220 mm and a sample standard deviation of 5 mm. Does this data suggest that true average wafer thickness is something other than the target value?
In semiconductor manufacturing, wet chemical etching is often used to remove silicon from the backs of wafers prior to metalization. The etch rate is an important characteristic in this process and known to follow a normal distribution. Two different etching solutions have been compared, using two random samples of 10 wafers for each solution. The observed etch rates are as follows (in mils/min): Solution 1 Solution 2 9.5 10.6 10.1 10.0 9.4 10.3 10.6 10.2 9.3 10.0 10.7 10.7 9.6...
A new process has been developed for applying photoresist film to 125 mm silicon wafers used in manufacturing integrated circuits. Ten wafers were tested, and the following photoresist film thickness measurements were observed: 13.3987, 13.3957, 13.3902, 13.4015, 13.4001, 13.3918, 13.3965, 13.3925, 13.3946 and 13.4002 angstroms (1 angstrom = 1x 10- metre). The photoresist film process has shown from past results that the distribution is normal. Use a = 0.05 and s = .00391 a. Test the hypothesis that the mean...
summatize the following info and break them into differeng key points. write them in yojr own words
apartus
6.1 Introduction—The design of a successful hot box appa- ratus is influenced by many factors. Before beginning the design of an apparatus meeting this standard, the designer shall review the discussion on the limitations and accuracy, Section 13, discussions of the energy flows in a hot box, Annex A2, the metering box wall loss flow, Annex A3, and flanking loss, Annex...