Question

In semiconductor manufacturing, wet chemical etching is often used to remove silicon from the backs of wafers prior to metalization. The etch rate is an important characteristic in this process and known to follow a normal distribution. Two different etching solutions have been compared, using two random samples of 10 wafers for each solution. The observed etch rates are as follows (in mils/min):

Solution 1			Solution 2
9.5	10.6		10.1	10.0
9.4	10.3		10.6	10.2
9.3	10.0		10.7	10.7
9.6	10.3		10.4	10.4
10.2	10.1		10.5	10.3

Test the hypothesis H0:σ12=σ22 against H1:σ12≠σ22 using α=0.05.

Round your answer to 3 decimal places:

Test statistic: _________________

Conclusion: ___________ (Reject of Fail to reject)  H₀.

Answer 1

a,a 2. 3.40L O 029 con eluda tho ain s