Question

WITHOUT THE USE OF TECHNOLOGY. SHOW ALL STPES PLEASE.

Question 3.Use Data from Textbook Question 2.37, test the hypothesis that mean deflection temperatures are same for the two different formulations under the assumption that variances are different for thee two underlying populations. DO NOT USE TECHNOLOGY 2.37. In semiconductor manufacturing wet chemical etching is often used to remove silicon from the backs of wafers prior to metalization. The etch rate is an important characteristic of this process. Two different etching solutions are being evaluated. Eight randomly selected wafers have been etched in each solution, and the observed etch rates (in mils/min) are as follows. Solution 1 Solution2 9.9 10.6 4 10.3 9.3 9.8 10.2 10.0 10.7 10.5 10.6 10.2 10.4 10.3 10.0 10.3

Answer 1

s1 = 0.4504

s2 =3.1627