Here we have data:
Solution1 | solution2 |
9.9 | 10.2 |
9.4 | 10 |
10 | 10.7 |
10.3 | 10.5 |
10.6 | 10.6 |
10.3 | 10.2 |
9.3 | 10.4 |
9.8 | 10.3 |
Here calculated by Excel
Excel output:
t-Test: Two-Sample Assuming Equal Variances | ||
Variable 1 | Variable 2 | |
Mean | 9.95 | 10.3625 |
Variance | 0.2029 | 0.0541 |
Observations | 8 | 8 |
Pooled Variance | 0.1285 | |
Hypothesized Mean Difference | 0 | |
df | 14 | |
t Stat | -2.3016 | |
P(T<=t) one-tail | 0.0186 | |
t Critical one-tail | 1.7613 | |
P(T<=t) two-tail | 0.0372 | |
t Critical two-tail | 2.1448 |
Hypotheses:
Ho; μ1 = μ2
Ha; μ1≠ μ2
test statistics:
t = - 2.30
Critical value:
tc = 2.145
Here we have sufficient evidence to reject the null hypothesis, because t-observed value (-2.30) is less than t-critical value (2.145) and in the rejection region.
Conclusion: We can say that solution1 mean is not equal to solution2
Question 2. Use Data from Textbook Question 2.37, test the hypothesis that mean deflection temperatures are...
ANSWER WITHOUT THE USE OF TECHNOLOGY. Question 2. Use Data from Textbook Question 2.37, test the hypothesis that mean deflection temperatures are same for the two different formulations under the assumption that variances are the same for the two underlying populations. DO NOT USE TECHNOLOGY. 2.37. In semiconductor manufacturing wet chemical etching is often used to remove silicon from the backs of wafers prior to metalization. The etch rate is an important characteristic of this process. Two different etching solutions...
WITHOUT THE USE OF TECHNOLOGY. SHOW ALL STPES PLEASE. Question 3.Use Data from Textbook Question 2.37, test the hypothesis that mean deflection temperatures are same for the two different formulations under the assumption that variances are different for thee two underlying populations. DO NOT USE TECHNOLOGY 2.37. In semiconductor manufacturing wet chemical etching is often used to remove silicon from the backs of wafers prior to metalization. The etch rate is an important characteristic of this process. Two different etching...
In semiconductor manufacturing, wet chemical etching is often used to remove silicon from the backs of wafers prior to metalization. The etch rate is an important characteristic in this process and known to follow a normal distribution. Two different etching solutions have been compared, using two random samples of 10 wafers for each solution. The observed etch rates are as follows (in mils/min): Solution 1 Solution 2 9.5 10.6 10.1 10.0 9.4 10.3 10.6 10.2 9.3 10.0 10.7 10.7 9.6...