Question

Assume you are having problems with PR adhesion to your sample, what three things could you do to improve photoresist adhesion (assume nothing was being done before)?

Answer 1

first the substrate temperature,

that the priming rection is lenient to temperature variation

and does to be hot to get rid of molecular bound water, so heat transfer can be the critical thing.

the HMDS date is kept under the minimizing the reaction degrade with the time function ,

if HMDS date is more that probably 1 year old then it should replace..

and put resist softbaking conditions that thick resists and polymides require a slow ramp and bake out simply remove from the coating..

and also finally keep at that the substrate in a surface heavlily phosphorous doping..