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A microprocessor that is 1cm × 1cm, outputs 100 W of heat that conducts through a...
4.25 An aluminum heat sink (k 230 W/m - K), used to cool an array of...
4.25 An aluminum heat sink (k 230 W/m - K), used to cool an array of electronic chips, consists of a square chan nel of inner width w -30 mm, through which liquid flow may be assumed to maintain a uniform surface tem perature of T 20°C. The outer width and length of the channel are W= 40 mm and L = 160 mm, respectively. Chip, T RiC Heat sink T. 2 T1 Coolant If N 120 chips attached to...
blem 4 (20 pts) A square chip that is 12.7mm on a side has a maximum allowable chip operating temperature -75°C. To dissipate heat produced in the chip, a 4 x 4 array of copper (k-400 W/m.K) pin fins...
blem 4 (20 pts) A square chip that is 12.7mm on a side has a maximum allowable chip operating temperature -75°C. To dissipate heat produced in the chip, a 4 x 4 array of copper (k-400 W/m.K) pin fins is proposed to be etallurgically joined to the outer surface of the chip. The convection coefficient is h-250 W/m'K and ambient air mperature isTo-20°C. The pin fin dimeter is D,-1.5mm and length is L,-16mm. Assuming steady-state uniform chip temperature Te-75°C and...
4. Through-silicon-via (TSV) has been widely used in electronics, which is a vertical metal via t...
4. Through-silicon-via (TSV) has been widely used in electronics, which is a vertical metal via that passes completely through a silicon substrate. Consider a metal TSV embedded in the silicon substrate. The TSV is made from steel and copper, which have the thermal conductivities of ksteel 50 Wm K, and k-400 Wm K. The silicon has a thermal conductivity of ks-100 Wm K-1. The analysis of thermal transport in the TSV-Si composite can start from its unit cell due to...
4.25 An aluminum heat sink (k 230 W/m - K), used to cool an array of electronic chips, consists of a square chan nel of inner width w -30 mm, through which liquid flow may be assumed to maintain a uniform surface tem perature of T 20°C. The outer width and length of the channel are W= 40 mm and L = 160 mm, respectively. Chip, T RiC Heat sink T. 2 T1 Coolant If N 120 chips attached to...
blem 4 (20 pts) A square chip that is 12.7mm on a side has a maximum allowable chip operating temperature -75°C. To dissipate heat produced in the chip, a 4 x 4 array of copper (k-400 W/m.K) pin fins is proposed to be etallurgically joined to the outer surface of the chip. The convection coefficient is h-250 W/m'K and ambient air mperature isTo-20°C. The pin fin dimeter is D,-1.5mm and length is L,-16mm. Assuming steady-state uniform chip temperature Te-75°C and...
4. Through-silicon-via (TSV) has been widely used in electronics, which is a vertical metal via that passes completely through a silicon substrate. Consider a metal TSV embedded in the silicon substrate. The TSV is made from steel and copper, which have the thermal conductivities of ksteel 50 Wm K, and k-400 Wm K. The silicon has a thermal conductivity of ks-100 Wm K-1. The analysis of thermal transport in the TSV-Si composite can start from its unit cell due to...
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