Question

What is the best method that you would use to deposit the following and why? Please be specific on the method used. a) Tin b) Tungsten c) NiCr d) High quality SiO2 film e) Increase conductivity of Silicon wafer f) Silicon nitride film

Answer 1

Ans Sn deposition method :- Different physical vapour deposition (PVD) method Tin film) (e.g.sputter deposition Cathodic are deposition in Electron beam beating) and chemical rapour deposition (eus). by Tungsten deposition method :- chemical vapour deposition (eu) Nier deposition method :- Sputtering method. ay High quality sioz film :- Inductively coupled plasma enhanced Chemical deposition method vapour deposition (IC PEOND). ey Increase Conductivity of Silicon wafer deposition method : Pulsed laser Leporition. f) Silicon nitride film :-) Low pressure clensical ropour deposition deposition method COLPEVD) G ü Plasma enhanced chemical vapour deporition (PEEVD) The above methods are used for deposition of different film and experimentally it in seen that these methods given best result bone to other deposition method. So, these methods are considered as the best method of film de