Given data :-
Let the heat generated due to power dissipation per unit area in chip is q . From that heat generated, some amount of heat will be transfered by the top surface ( Let say ) and remaining amount of heat will be transfered from the bottom surface of the chip ( Let say ).
So,
(1) Heat transfer from the top surface,
Now heat transfer from the top surface of the chip per unit area to the surrounding fluid can be found by,
Where , = Total Thermal resistance between the top surface of chip and surrounding
So, = Thermal contact resistance of chip/Aluminium interface + Conductive resistance of Aluminium cover + Concective resistance of fluid
So,
So,
So,
Now,
So,
(2) Heat transfer from the bottom surface of the chip ,
Heat transfer from the bottom surface of the chip per unit area to the surrounding fluid can be found by,
So,
So,
So,
Now, Total heat generation in the chip per unit surface area , q
So,
Now, Total Power Dissipation in the chip can be given by,
Q = q × Surface area of the chip
So, Q = 116250 × = 11.625 watt
So, maximum power dissipation allowed in the chip is 11.625 Watt.
(8 marks) The heat generated from power dissipation of a silicon chip is transferred by convection...
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