Question

6) Using Coffin-Manson low cycle fatigue model for flip-chip technology (see the notes posted), predict the number of thermal cycles the chip can sustain, using the following numbers Δα-10x10-6 /°C Temperature variation Δ T=100°C Solder joint height, 0.030mm Effective IC(integrated circuit) length 2mm The model is intended for using for low cycle fatigue, such as under accelerated testing condition. In most of the real applications under normal condition, the fatigue usually occurs after many cycles. We call it high cycle fatigue.

Answer 1