Question

4. A nickel plating process has trouble with consistency of the plating thickness. We want to use design of experiment to improve the process. Our target plating thickness is 116 micrometers The process variables that we can test are t (Time) and T (solution temperature). We want to find t and T that minimize the variance in thickness. The results of a two-level, two-factor set of experiments are: t-plating time in seconds T- solution temperature in degrees C P- plate thickness micrometers S P 2.28 4 4 12 12 16 32 16 32 116.1116.9 112.6 118.7114.9115.84 106.7107.5105.9107.1106.5 106.74 115.5119.2 114.7118.3116.5 116.84 123.2125.1 124.5 1.88 0.73 124 124.7 124.3 Develop models to predict BOTH (i.e. two models) the thickness, P, and the variation (S P). Use these models to determine the important factors and then use the models to find the values of t and T that minimized S P when P -110 micrometers Show the plots of the coefficients for both models. Describe how you chose the settings to minimize S P while also achieving desired P.

Answer 1

aomi to coppey glht 巳 the onetal Bond tok ele the that ae Com to delomime the