Question

Electronic chips generate heat and thus they need to be cooled to prevent failure Microchannel heatsinks that use liquid coolants are an option for cooling of electronic chips; the figure below shows a typical microchannel heatsink. It is desired to design a microchannel heatsink for cooling of an electronic chip with planar dimensions of 2.54 cm by 2.54 cm and generating 70 W (Q) of heat; the maximum temperature of the electronic chip cannot be greater than 45°C (During operation, the microchannel heatsink will be directly attached to the top of the electronic chip and for this matter its planar dimensions' (LHs and WHs) always match that of the electronic chip; the coolant is continuously transported through the entire microchannel heatsink during operation. The heatsink is to be made using silicon wafers which have thickness of 500 μm (t). The heatsink has multiple parallel microchannels, with same dimensions. and uses water as the coolant. The inlet temperature of the coolant is 10°C (Tin). Due to manufacturing limitations, the microchannel width (WcH) and microchannel spacing (WsP) of each microchannel cannot be smaller than 50 um and the depth cannot be greater than 300 um (HcH). As microchannels are employed in the heatsink, the maximum width and spacing of the microchannel is always kept below 1000 um. The maximum volumetric flow rate (V) possible through the entire microchannel heatsink is limited by the allowable pressure drop between the inlet and outlet which cannot be greater than 5 Psi (Pax. Once the microchannel heatsink is designed and fabricated, it is sealed using a glass wafer; thus, the glass wafer is not part of the d the microchannel heatsink. esign process of Outlet Inlct Silicon

Answer 1

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