Two-Dimensional Steady and Transient Conduction - Cooling a very large scale microelectronic chip,
A simplified representation for cooling in very large-scale integration (VLSI) of microelectronics is shown in the sketch below. A silicon chip is mounted in a dielectric substrate, and one surface of the system is convectively cooled, while the reminding surfaces are well insulated from the surrounding. The problem is rendered two dimensional by assuming the system to be very large in the direction perpendicular to the paper. Under steady state (1) and transient (2) operation electronic power dissipation in the chip provide for uniform volumetric heating at a rate of q. However, heating rate is limited by the restrictions on the maximum temperature that the chip is allowed to achieve.
Cooling information is T=20 °C and h=500 W/m2.K the conductive heat transfer. Coefficient of chip is kc = 50 W/m.K, and q = 10^7 W I m^3 , the heat conduction coefficient for the substrate is ks = 5 W/m.K.
For the condition shown on the sketch, will the maximum temperature in the chips exceed 85 °C, the maximum allowable operating temperature set by industry standards?
A grid spacing of 1.5 mm is suggested.
*Find the temperature distribution in the chips and substrate
Plot the temperatures of these three successive nodes versus time within 5 min of chip's operation.
Assumption:
Constant Properties
Thermal heat transfer coefficients are constant
Radiation heat transfer negligible
Two-Dimensional Steady and Transient Conduction - Cooling a very large scale microelectronic chip, A simplified representation...
A simplified representation for cooling in very large- scale integration (VLSI) of microelectronics is shown in the sketch below. A silicon chip is mounted in a dielectric substrate, and one surface of the system is convectively cooled, while the reminding surfaces are well insulated from the surrounding. The problem is rendered two dimensional by assuming the system to be very large in the direction perpendicular to the paper. Under steady state (1) and transient (2) operation electronic power dissipation in...
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W kg m-K m3 Two-Dimensional Steady and transient Conduction - Heat Sink Aluminum fins with triangle profiles (k = 290 p = 2800 ,C= 900 shown in the accompanying figure, are used to remove heat from a surface kg-K whose temperature is T, = 150°C. The temperature of the surrounding air is 20°C. The natural heat transfer coefficient associated with the surrounding air is h = 190, Determine the temperature distribution along a fin. w m-K Air To, h 20...
Use k=320 W/mK for your calculation w m-K Two-Dimensional Steady and transient Conduction - Heat Sink Aluminum fins with triangle profiles (k = 370- p=2800 kg 900 shown in the accompanying figure, are used to remove heat from a surface whose temperature is Tg = 150°C. The temperature of the surrounding air is 20°C. The natural heat transfer coefficient associated with the surrounding air is h = 190- Determine the temperature distribution along a fin. w m- T., 20 mm...
Use k=320 W/mK for your calculation w m-K Two-Dimensional Steady and transient Conduction - Heat Sink Aluminum fins with triangle profiles (k = 370- p=2800 kg 900 shown in the accompanying figure, are used to remove heat from a surface whose temperature is Tg = 150°C. The temperature of the surrounding air is 20°C. The natural heat transfer coefficient associated with the surrounding air is h = 190- Determine the temperature distribution along a fin. w m- T., 20 mm...
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