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Steady-State Conduction 3.25 Approximately 10° discrete electrical components can single integrated circuit (chip), with 30,000 W/m...
As more and more components are placed on a single integrated circuit (chip), the amount of heat that is dissipated continues to increase. However, this increase is limited by the maximum allowable...
As more and more components are placed on a single integrated
circuit (chip), the amount of heat that is dissipated continues to
increase. However, this increase is limited by the maximum
allowable chip operating temperature, which is approximately 75°C.
To maximize heat dissipation. it is proposed that a 4 × 4 array of
copper pin fins of length 12.7 mm and diameter 1.5mm be
metallurgically joined to the outer surface of a square chip that
is 12.7 mm on a...
Two-Dimensional Steady and Transient Conduction - Cooling a very large scale microelectronic chip, A simplified representation...
Two-Dimensional Steady and Transient Conduction - Cooling a very
large scale microelectronic chip,
A simplified
representation for cooling in very large-scale integration (VLSI)
of microelectronics is shown in the sketch below. A silicon chip is
mounted in a dielectric substrate, and one surface of the system is
convectively cooled, while the reminding surfaces are well
insulated from the surrounding. The problem is rendered two
dimensional by assuming the system to be very large in the
direction perpendicular to the paper....
blem 4 (20 pts) A square chip that is 12.7mm on a side has a maximum allowable chip operating temperature -75°C. To dissipate heat produced in the chip, a 4 x 4 array of copper (k-400 W/m.K) pin fins...
blem 4 (20 pts) A square chip that is 12.7mm on a side has a maximum allowable chip operating temperature -75°C. To dissipate heat produced in the chip, a 4 x 4 array of copper (k-400 W/m.K) pin fins is proposed to be etallurgically joined to the outer surface of the chip. The convection coefficient is h-250 W/m'K and ambient air mperature isTo-20°C. The pin fin dimeter is D,-1.5mm and length is L,-16mm. Assuming steady-state uniform chip temperature Te-75°C and...
(2) In a manufacturing process, a transparent film is being bonded to a substrate as shown...
(2) In a manufacturing process, a transparent film is being bonded to a substrate as shown in the sketch. To cure the bond at a temperature To, a radiant source is used to provide a heat flux q"o (W/m?), all of which is absorbed at the bonded surface. The back of the substrate is maintained at T, while the free surface of the film is exposed to air at Too and a convection heat transfer coefficient h. 9 ky =...
Problem 1 Consider a 15-mm by 15-mm chip that is cooled on its top surface by a 6 m/s flow of 25 ...
Problem 1 Consider a 15-mm by 15-mm chip that is cooled on its top surface by a 6 m/s flow of 25 °C air. Any heat transfer from its bottom surface to the circuit board is ignored. Because of the chip construction, the electrical power dissipated in the chip results in a uniform heat flux over the surface of the chip. If the maximum temperature that any part of the chip can experience is 80 "C, determine the maximum allowable...
Consider steady-state conditions for one-dimensional conduction
Consider steady-state conditions for one-dimensional conduction in a plane wall having a thermal conductivity k = 50 W/m·K and thickness L = 0.35 m, with no internal heat generation Determine the heat flux and the unknown quantity for each case and sketch the temperature distribution, indicating the direction of the heat flux.
3. The wall shown in the figure below has thickness L 0.25 m and uniform thermal...
3. The wall shown in the figure below has thickness L 0.25 m and uniform thermal conductivity k-1 W/mK. It is exposed to circulating fluid on the surface at x = L, where the temperature ofthe fluid is T-= 30°C and the convection coefficient is h = 4 W/m2.K. The surface at x = 0 is maintained at constant temperature T-20 °C. Assume ID heat flux, and that the system is at steady state a) b) Determine the temperature distribution...
7.33 A square (10 mm × 10 mm) silicon chip is insulated on one side and cooled on the opposite si...
7.33 A square (10 mm × 10 mm) silicon chip is insulated on one side and cooled on the opposite side by atmospheric air in parallel flow at u 20 m/s and T 24°C. When in use, electrical power dissipation within the chip maintains a uniform heat flux at the cooled surface. If the chip temperature may not exceed 80°C at any point on its surface, what is the maximum allowable power? What is the maximunm allowable power if the...
Consider two-dimensional, steady-state conduction in a square cross section with prescribed surfa...
need help with c and d
Consider two-dimensional, steady-state conduction in a square cross section with prescribed surface temperatures shown in the figure. 2) 100°C a) Determine the temperatures at nodes 1, 2, 3, and 4 Estimate the midpoint temperature. Reducing the mesh size by a factor of 2, determine the corresponding nodal temperatures. Compare your results with those from the coarser grid. b) 50°C 200°c c) If the body generates heat at a rate of 20,000 W/m determine the...
A 50 mm thick steel plate (AISI347) has a uniform heat flux applied to its bottom...
A 50 mm thick steel plate (AISI347) has a uniform heat flux
applied to its bottom surface by a heater. The heater is in contact
with the steel plate, and the interface between the heater and
steel has a contact resistance of 2.0 x 10-4
m2*K/W. The top surface of the plate is exposed to
surrounding air (T = 20oC, h = 10 W/m2*K) and
exchanges radiation with surroundings at Tsur =
10oC. The emissivity of the plate is 0.85....
As more and more components are placed on a single integrated
circuit (chip), the amount of heat that is dissipated continues to
increase. However, this increase is limited by the maximum
allowable chip operating temperature, which is approximately 75°C.
To maximize heat dissipation. it is proposed that a 4 × 4 array of
copper pin fins of length 12.7 mm and diameter 1.5mm be
metallurgically joined to the outer surface of a square chip that
is 12.7 mm on a...
Two-Dimensional Steady and Transient Conduction - Cooling a very
large scale microelectronic chip,
A simplified
representation for cooling in very large-scale integration (VLSI)
of microelectronics is shown in the sketch below. A silicon chip is
mounted in a dielectric substrate, and one surface of the system is
convectively cooled, while the reminding surfaces are well
insulated from the surrounding. The problem is rendered two
dimensional by assuming the system to be very large in the
direction perpendicular to the paper....
blem 4 (20 pts) A square chip that is 12.7mm on a side has a maximum allowable chip operating temperature -75°C. To dissipate heat produced in the chip, a 4 x 4 array of copper (k-400 W/m.K) pin fins is proposed to be etallurgically joined to the outer surface of the chip. The convection coefficient is h-250 W/m'K and ambient air mperature isTo-20°C. The pin fin dimeter is D,-1.5mm and length is L,-16mm. Assuming steady-state uniform chip temperature Te-75°C and...
(2) In a manufacturing process, a transparent film is being bonded to a substrate as shown in the sketch. To cure the bond at a temperature To, a radiant source is used to provide a heat flux q"o (W/m?), all of which is absorbed at the bonded surface. The back of the substrate is maintained at T, while the free surface of the film is exposed to air at Too and a convection heat transfer coefficient h. 9 ky =...
Problem 1 Consider a 15-mm by 15-mm chip that is cooled on its top surface by a 6 m/s flow of 25 °C air. Any heat transfer from its bottom surface to the circuit board is ignored. Because of the chip construction, the electrical power dissipated in the chip results in a uniform heat flux over the surface of the chip. If the maximum temperature that any part of the chip can experience is 80 "C, determine the maximum allowable...
3. The wall shown in the figure below has thickness L 0.25 m and uniform thermal conductivity k-1 W/mK. It is exposed to circulating fluid on the surface at x = L, where the temperature ofthe fluid is T-= 30°C and the convection coefficient is h = 4 W/m2.K. The surface at x = 0 is maintained at constant temperature T-20 °C. Assume ID heat flux, and that the system is at steady state a) b) Determine the temperature distribution...
7.33 A square (10 mm × 10 mm) silicon chip is insulated on one side and cooled on the opposite side by atmospheric air in parallel flow at u 20 m/s and T 24°C. When in use, electrical power dissipation within the chip maintains a uniform heat flux at the cooled surface. If the chip temperature may not exceed 80°C at any point on its surface, what is the maximum allowable power? What is the maximunm allowable power if the...
need help with c and d
Consider two-dimensional, steady-state conduction in a square cross section with prescribed surface temperatures shown in the figure. 2) 100°C a) Determine the temperatures at nodes 1, 2, 3, and 4 Estimate the midpoint temperature. Reducing the mesh size by a factor of 2, determine the corresponding nodal temperatures. Compare your results with those from the coarser grid. b) 50°C 200°c c) If the body generates heat at a rate of 20,000 W/m determine the...
A 50 mm thick steel plate (AISI347) has a uniform heat flux
applied to its bottom surface by a heater. The heater is in contact
with the steel plate, and the interface between the heater and
steel has a contact resistance of 2.0 x 10-4
m2*K/W. The top surface of the plate is exposed to
surrounding air (T = 20oC, h = 10 W/m2*K) and
exchanges radiation with surroundings at Tsur =
10oC. The emissivity of the plate is 0.85....
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