Page 4 of 12 Your Initials (c) If there are 10 chips and the temperature of each chip may not exceed 80 °C, what is the maximum allowable heat flux and where is this maximum temperature located? (10 pts) the leading edge, is the turbulence promoter perfered to keep the chip away from overheating with t consumption compare to part e? Explain. (4 pts) (d) If a turbulence promoter could be used to trip the boundary layer at
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Your Initials ). Convection external flow An array of silicon chips, each of length L 10 mm and width w 10 mm on a side, is insulated on one surface and cooled on the opposite surface by atmospheric...
7.33 A square (10 mm × 10 mm) silicon chip is insulated on one side and cooled on the opposite si...
7.33 A square (10 mm × 10 mm) silicon chip is insulated on one side and cooled on the opposite side by atmospheric air in parallel flow at u 20 m/s and T 24°C. When in use, electrical power dissipation within the chip maintains a uniform heat flux at the cooled surface. If the chip temperature may not exceed 80°C at any point on its surface, what is the maximum allowable power? What is the maximunm allowable power if the...
Problem 1 Consider a 15-mm by 15-mm chip that is cooled on its top surface by a 6 m/s flow of 25 ...
Problem 1 Consider a 15-mm by 15-mm chip that is cooled on its top surface by a 6 m/s flow of 25 °C air. Any heat transfer from its bottom surface to the circuit board is ignored. Because of the chip construction, the electrical power dissipated in the chip results in a uniform heat flux over the surface of the chip. If the maximum temperature that any part of the chip can experience is 80 "C, determine the maximum allowable...
this is a mechanical engineering question heat transfer Problem 3: An array of six square silicon chips, each 12 mm lon...
this is a mechanical engineering question heat
transfer
Problem 3: An array of six square silicon chips, each 12 mm long on a side, are laid side by side on a motherboard. They are insulated on the bottom surface and exposed to cooling airflow on the top surface, at a velocity of 20 m/s and an air temperature of 20°C. The chips all dissipate the same power such that they maintain a uniform heat flux condition at their top surface...
4. A silicon chip is attached with a copper pin fin in order to enhance the...
4. A silicon chip is attached with a copper pin fin in order to enhance the heat transfer. The square shape silicon chip has a width of W=10 mm on each side. The length and diameter of the copper pin are L=20 mm and D=4 mm, respectively. During the operation, the surface of the chip, as well as the base of the pin, are maintained at the temperature of To=375 K. The thermal conductivity of the copper pin fin is...
4. A silicon chip is attached with a copper pin fin in order to enhance the...
4. A silicon chip is attached with a copper pin fin in order to enhance the heat transfer. The square shape silicon chip has a width of W=10 mm on each side. The length and diameter of the copper pin are L=20 mm and D=4 mm, respectively. During the operation, the surface of the chip, as well as the base of the pin, are maintained at the temperature of To=375 K. The thermal conductivity of the copper pin fin is...
4. A silicon chip is attached with a copper pin fin in order to enhance the...
4. A silicon chip is attached with a copper pin fin in order to enhance the heat transfer. The square shape silicon chip has a width of W=10 mm on each side. The length and diameter of the copper pin are L=20 mm and D=4 mm, respectively. During the operation, the surface of the chip, as well as the base of the pin, are maintained at the temperature of To=375 K. The thermal conductivity of the copper pin fin is...
A 69-cm x 69-cm circuit board that contains 121 square chips on one side is to...
A 69-cm x 69-cm circuit board that contains 121 square chips on one side is to be cooled by combined natural convection and radiation by mounting it on a vertical surface in a room at 25°C. Each chip dissipates 0.18 W of power, and the emissivity of the chip surfaces is 0.7. Assume the heat transfer from the back side of the circuit board to be negligible, and the temperature of the surrounding surfaces to be the same as the...
Your Initials: Page 5 of 12 Problem 3 (20 pts): Heat exchanger In a supercomputer, signal propagation delays are redaced by resorting to high-density circuit arrangements which are cooled b...
Your Initials: Page 5 of 12 Problem 3 (20 pts): Heat exchanger In a supercomputer, signal propagation delays are redaced by resorting to high-density circuit arrangements which are cooled by immersing them in a special dielectric liquid. The fluid is pumped in a closed loop through the computer and an adjoining shell-and-tube heat exchanger having one shell and two tube passes. During mormal operation, heat gencrated within the computer is transferred to the dielectric fluid passing therough the computer at...
7.33 A square (10 mm × 10 mm) silicon chip is insulated on one side and cooled on the opposite side by atmospheric air in parallel flow at u 20 m/s and T 24°C. When in use, electrical power dissipation within the chip maintains a uniform heat flux at the cooled surface. If the chip temperature may not exceed 80°C at any point on its surface, what is the maximum allowable power? What is the maximunm allowable power if the...
Problem 1 Consider a 15-mm by 15-mm chip that is cooled on its top surface by a 6 m/s flow of 25 °C air. Any heat transfer from its bottom surface to the circuit board is ignored. Because of the chip construction, the electrical power dissipated in the chip results in a uniform heat flux over the surface of the chip. If the maximum temperature that any part of the chip can experience is 80 "C, determine the maximum allowable...
this is a mechanical engineering question heat
transfer
Problem 3: An array of six square silicon chips, each 12 mm long on a side, are laid side by side on a motherboard. They are insulated on the bottom surface and exposed to cooling airflow on the top surface, at a velocity of 20 m/s and an air temperature of 20°C. The chips all dissipate the same power such that they maintain a uniform heat flux condition at their top surface...
4. A silicon chip is attached with a copper pin fin in order to enhance the heat transfer. The square shape silicon chip has a width of W=10 mm on each side. The length and diameter of the copper pin are L=20 mm and D=4 mm, respectively. During the operation, the surface of the chip, as well as the base of the pin, are maintained at the temperature of To=375 K. The thermal conductivity of the copper pin fin is...
4. A silicon chip is attached with a copper pin fin in order to enhance the heat transfer. The square shape silicon chip has a width of W=10 mm on each side. The length and diameter of the copper pin are L=20 mm and D=4 mm, respectively. During the operation, the surface of the chip, as well as the base of the pin, are maintained at the temperature of To=375 K. The thermal conductivity of the copper pin fin is...
4. A silicon chip is attached with a copper pin fin in order to enhance the heat transfer. The square shape silicon chip has a width of W=10 mm on each side. The length and diameter of the copper pin are L=20 mm and D=4 mm, respectively. During the operation, the surface of the chip, as well as the base of the pin, are maintained at the temperature of To=375 K. The thermal conductivity of the copper pin fin is...
Your Initials: Page 5 of 12 Problem 3 (20 pts): Heat exchanger In a supercomputer, signal propagation delays are redaced by resorting to high-density circuit arrangements which are cooled by immersing them in a special dielectric liquid. The fluid is pumped in a closed loop through the computer and an adjoining shell-and-tube heat exchanger having one shell and two tube passes. During mormal operation, heat gencrated within the computer is transferred to the dielectric fluid passing therough the computer at...
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