The heat generated in the circuitry on the surface of a silicon chip (k= 130 W/m∙K) is con...

The heat generated in the circuitry on the surface of a silicon chip (k= 130 W/m∙K) is conducted to the ceramic substrate to which it is attached. The chip is 6 mm × 6 mm in size and 0.5 mm thick and dissipates 5 W of power. Disregarding any heat transfer through the 0.5-mm high side surfaces, determine the temperature difference between the front and back surfaces of the chip in steady operation.