The accompanying data on x = current density (mA/cm2) and y = rate of deposition (μm/min )appeared in the article “Plating of 60/40 Tin/Lead Solder for Head Termination Metallurgy” (Plating and Surface Finishing, Jan. 1997: 38–40). Do you agree with the claim by the article’s author that “a linear relationship was obtained from the tin-lead rate of deposition as a function of current density”? Explain your reasoning.
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