You are contracted to design an image processing system for detecting imperfections on the inside of certain solid plastic wafers. The wafers are examined using an X-ray imaging system, which yields 8-bit images of size 512 ×512. In the absence of imperfections, the images appear “bland,” having a mean intensity of 100 and variance of 400. The imperfections appear as bloblike regions in which about 70% of the pixels have excursions in intensity of 50 intensity levels or less about a mean of 100. A wafer is considered defective if such a region occupies an area exceeding 20 ×20 pixels in size. Propose a system based on texture analysis.
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