Applying the Exergy Balance: Closed Systems As shown in Fig. P7.44, a sili...

Applying the Exergy Balance: Closed Systems

As shown in Fig. P7.44, a silicon chip measuring 5 mm on a side and 1 mm in thickness is embedded in a ceramic substrate. At steady state, the chip has an electrical power input of 0.225 W. The top surface of the chip is exposed to a coolant whose temperature is 20^oC. The heat transfer coefficient for convection between the chip and the coolant

is 150 W/m² · K. Heat transfer by conduction between the chip and the substrate is negligible. Determine (a) the surface temperature of the chip, in ^oC, and (b) the rate of exergy destruction within the chip, in W. What causes the exergy destruction in this case? Let T₀ = 293 K.