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In a manufacturing process, a transparent film is being bonded to a substrate as shown in...
(2) In a manufacturing process, a transparent film is being bonded to a substrate as shown...
(2) In a manufacturing process, a transparent film is being bonded to a substrate as shown in the sketch. To cure the bond at a temperature To, a radiant source is used to provide a heat flux q"o (W/m?), all of which is absorbed at the bonded surface. The back of the substrate is maintained at T, while the free surface of the film is exposed to air at Too and a convection heat transfer coefficient h. 9 ky =...
The ice on the rear window of an automobile is defrostedby attaching a thin, transparent, film...
The ice on the rear window of an automobile is defrostedby attaching a thin, transparent, film type heatingelement to its inner surface. By electrically heating this element, a uniform heat flux may be established at the inner surface.The insideair temperature and convection heat transfer coefficient are T,i= 25°C and hi= 25W/(m2-K), while the outsideair temperature isT,o= -10°C.For 4-mm thick window glass, determine (a) the electric power required per unit window area to maintain an inner surface temperature of 15°C and...
Do part B with matlab code The rear window of an automobile is defogged by attach...
Do
part B with matlab code
The rear window of an automobile is defogged by attach ing a thin, transparent, film-type heating element to its inner surface. By electrically heating this element, a uni- form heat flux may be established at the inner surface For 4-mm-thick window glass, determine the electrical power required per unit window area to maintain arn inner surface temperature of 15°C when the interior air temperature and convection coefficient are To 25°C and hi = 10...
list the assumptions (if appropriate), provide a sketch (if appropriate) A thin flat plate of length L-120 mm, thicknes...
list the assumptions (if appropriate), provide a sketch
(if appropriate)
A thin flat plate of length L-120 mm, thickness t=4 mm, width W=30 mm, and thermal conductivity k-20 W/m-K is thermally joined to heat sinks at different temperatures, where T(x 0) = To-100°C and T(x = L) Ti-35°C. The top surface of the plate is subjected to uniform heat flux q"-20 kW/m2, and the bottom surface of the plate is subjected to uniform convection with a convection coefficient of h-50...
A square, thin electronic chip is mounted to a substrate that is installed in a computer box whose interior walls a...
A square, thin electronic chip is mounted to a substrate that is installed in a computer box whose interior walls are maintained at Tr as shown. The chip is heated by an electrical circuit with power input Pelec and cooled by convection and radiation to the surrounding air and walls. The maximum allowable chip surface temperature is 85 °C. Tsur 25°C Substrate Air rad Chip, Pelec T 85°C, E 0.60 L-15 mm T=25°c h-4.2(T,-Ta)4 or qconv h=250 W/m2-K a) Write...
6.83 A disk of 20-mm diameter is covered with a water film. Under steady-state conditions, a heat...
6.83 A disk of 20-mm diameter is covered with a water film. Under steady-state conditions, a heater power of 200 mW is required to maintain the disk-water ilm at 305 K in dry air at 295 K and the observed evaporation rate is 2.55 × 10-4 kg/h. Air T 295 K Water film, T 305 K Disk, D = 20 mm Heater, 200 m (a) Calculate the average mass transfer convection (b) Calculate the average heat transfer convection (c) Do...
Defog Rear Window
To defog therear window of an automobile, a very thintransparent heating element is attached to the inner surface of the window. A Uniformheat flux of 1300 W/m2 is provided to the heating element for defogging a rear windowwith thickness of 5 mm. The interior temperature of the automobile is 22°C and theconvection heat transfer coefficient is 15 W/m2·K. The outside ambient temperature is−5°C and the convection heat transfer coefficient is 100 W/m2·K. If the thermalconductivity of the window is 1.2...
You've experienced convection cooling if you've ever extended your hand out the window of a moving...
You've experienced convection cooling if you've ever extended your hand out the window of a moving vehicle or into a flowing water stream. With the surface of your hand at a temperature of 30°C, determine the convection heat flux for (a) a vehicle speed of 40 km/h in air at -8°C with a convection coefficient of 40 W/m2. K and (b) a velocity of 0.2 m/s in a water stream at 10°C with a convection coefficient of 900 W/m2 K....
Need help with part B (the sketching!) thanks Problem 3: A thin flat plate of length...
Need help with part B (the sketching!) thanks
Problem 3: A thin flat plate of length L-120 mm, thickness t=4 mm, width W=30 mm, and thermal conductivity k=20 W/m-K is thermally joined to heat sinks at different temperatures, where T(x = 0) = To-100 C and T(x = L) = T,-35°C. The top surface of the plate is subjected to uniform heat flux q"-20 kW/m2, and the bottom surface of the plate is subjected to uniform convection with a convection...
Steady-State Conduction 3.25 Approximately 10° discrete electrical components can single integrated circuit (chip), with 30,000 W/m...
Steady-State Conduction 3.25 Approximately 10° discrete electrical components can single integrated circuit (chip), with 30,000 W/m 27 abe- be placed electrical heat dissipation The chip, which is very thin, is exposed to a tric liquid at its outer surface, with h, = 1000 W/m2 K and T inner surface. The thermal contact resistance between the chip and the board is 10 m K/W, and the board thickness and thermal conductivity are L and kp 1 W/m K, respectively. The other...
(2) In a manufacturing process, a transparent film is being bonded to a substrate as shown in the sketch. To cure the bond at a temperature To, a radiant source is used to provide a heat flux q"o (W/m?), all of which is absorbed at the bonded surface. The back of the substrate is maintained at T, while the free surface of the film is exposed to air at Too and a convection heat transfer coefficient h. 9 ky =...
Do
part B with matlab code
The rear window of an automobile is defogged by attach ing a thin, transparent, film-type heating element to its inner surface. By electrically heating this element, a uni- form heat flux may be established at the inner surface For 4-mm-thick window glass, determine the electrical power required per unit window area to maintain arn inner surface temperature of 15°C when the interior air temperature and convection coefficient are To 25°C and hi = 10...
list the assumptions (if appropriate), provide a sketch
(if appropriate)
A thin flat plate of length L-120 mm, thickness t=4 mm, width W=30 mm, and thermal conductivity k-20 W/m-K is thermally joined to heat sinks at different temperatures, where T(x 0) = To-100°C and T(x = L) Ti-35°C. The top surface of the plate is subjected to uniform heat flux q"-20 kW/m2, and the bottom surface of the plate is subjected to uniform convection with a convection coefficient of h-50...
A square, thin electronic chip is mounted to a substrate that is installed in a computer box whose interior walls are maintained at Tr as shown. The chip is heated by an electrical circuit with power input Pelec and cooled by convection and radiation to the surrounding air and walls. The maximum allowable chip surface temperature is 85 °C. Tsur 25°C Substrate Air rad Chip, Pelec T 85°C, E 0.60 L-15 mm T=25°c h-4.2(T,-Ta)4 or qconv h=250 W/m2-K a) Write...
6.83 A disk of 20-mm diameter is covered with a water film. Under steady-state conditions, a heater power of 200 mW is required to maintain the disk-water ilm at 305 K in dry air at 295 K and the observed evaporation rate is 2.55 × 10-4 kg/h. Air T 295 K Water film, T 305 K Disk, D = 20 mm Heater, 200 m (a) Calculate the average mass transfer convection (b) Calculate the average heat transfer convection (c) Do...
You've experienced convection cooling if you've ever extended your hand out the window of a moving vehicle or into a flowing water stream. With the surface of your hand at a temperature of 30°C, determine the convection heat flux for (a) a vehicle speed of 40 km/h in air at -8°C with a convection coefficient of 40 W/m2. K and (b) a velocity of 0.2 m/s in a water stream at 10°C with a convection coefficient of 900 W/m2 K....
Need help with part B (the sketching!) thanks
Problem 3: A thin flat plate of length L-120 mm, thickness t=4 mm, width W=30 mm, and thermal conductivity k=20 W/m-K is thermally joined to heat sinks at different temperatures, where T(x = 0) = To-100 C and T(x = L) = T,-35°C. The top surface of the plate is subjected to uniform heat flux q"-20 kW/m2, and the bottom surface of the plate is subjected to uniform convection with a convection...
Steady-State Conduction 3.25 Approximately 10° discrete electrical components can single integrated circuit (chip), with 30,000 W/m 27 abe- be placed electrical heat dissipation The chip, which is very thin, is exposed to a tric liquid at its outer surface, with h, = 1000 W/m2 K and T inner surface. The thermal contact resistance between the chip and the board is 10 m K/W, and the board thickness and thermal conductivity are L and kp 1 W/m K, respectively. The other...
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