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Answer the following question. You must draw a schematic of the problem, clearly indicate the governing equation, list all units with all numbers/calculations, show all work in an orderly manner, and give your final answer in a complete sentence. 13. A very thin IC Chip, embedded on top of a Printed Circuit board is intended to dissipate 2.8W of heat. The 1.5cm by 1.5cm chip is cooled convectively on the top with air at 20C and a convective coefficient of 85W/m2K. The connection to the board has an expected thermal contact resistance of 1.4x104 m2w/K. The 4mm thick Printed Circuit Roard has a thermal conductivity of 1.5W/mK. The bottom of the Printed Circuit Board is cooled by natural convection with an ambient temperature of 25C and a convection coefficient of 40W/m2K. If the manufacturer specifies that the maximum chip temperature is 85, how much heat will ACTUALLY be dissipated by the chip?

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