It's a heat transfer question. The chip is square with dimensions 15mm by 15mm and 5mm...
It's a heat transfer question.
The chip is square with dimensions 15mm by 15mm and 5mm thickness with constant temperature Tc = 87 degrees C. At the top surface, 20 pin fins with convective ends are attached to the chip. The diameter of each fin, Dp = 1.5 mm, the length of each fin, Lp = 15 mm, and the thermal conductivity Kp = 400W/mK (For chip and fins). The convection coefficient, h = 50 W/(m2·K), and fluid temperature of T∞ = 300K. Plot the temperature distribution along the center axis line (T vs x).
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It's a heat transfer question.
The chip is square with dimensions 15mm by 15mm and 5mm...
It's a heat transfer question. The chip is square with dimensions 15mm by 15mm and 5mm...
It's a heat transfer question. The chip is square with dimensions 15mm by 15mm and 5mm thickness with constant temperature Tc = 87 degrees C at the bottom of the chip. At the top surface, 20 pin fins with convective ends are attached to the chip. Above the chip, we have the 20 fins plus we also have the exposed board area, which is total area of the chip minus the base area of the 20 fins. The diameter of...
It's a heat transfer question. Please do not copy from others, thank you. The chip is...
It's a heat transfer question. Please do not copy from others, thank you. The chip is square with dimensions 15mm by 15mm and 5mm thickness with constant temperature Tc = 87 degrees C at the bottom of the chip. At the top surface, 20 pin fins with convective ends are attached to the chip. Above the chip, we have the 20 fins plus we also have the exposed board area, which is total area of the chip minus the base...
blem 4 (20 pts) A square chip that is 12.7mm on a side has a maximum allowable chip operating temperature -75°C. To dissipate heat produced in the chip, a 4 x 4 array of copper (k-400 W/m.K) pin fins...
blem 4 (20 pts) A square chip that is 12.7mm on a side has a maximum allowable chip operating temperature -75°C. To dissipate heat produced in the chip, a 4 x 4 array of copper (k-400 W/m.K) pin fins is proposed to be etallurgically joined to the outer surface of the chip. The convection coefficient is h-250 W/m'K and ambient air mperature isTo-20°C. The pin fin dimeter is D,-1.5mm and length is L,-16mm. Assuming steady-state uniform chip temperature Te-75°C and...
4. A silicon chip is attached with a copper pin fin in order to enhance the...
4. A silicon chip is attached with a copper pin fin in order to enhance the heat transfer. The square shape silicon chip has a width of W=10 mm on each side. The length and diameter of the copper pin are L=20 mm and D=4 mm, respectively. During the operation, the surface of the chip, as well as the base of the pin, are maintained at the temperature of To=375 K. The thermal conductivity of the copper pin fin is...
4. A silicon chip is attached with a copper pin fin in order to enhance the...
4. A silicon chip is attached with a copper pin fin in order to enhance the heat transfer. The square shape silicon chip has a width of W=10 mm on each side. The length and diameter of the copper pin are L=20 mm and D=4 mm, respectively. During the operation, the surface of the chip, as well as the base of the pin, are maintained at the temperature of To=375 K. The thermal conductivity of the copper pin fin is...
4. A silicon chip is attached with a copper pin fin in order to enhance the...
4. A silicon chip is attached with a copper pin fin in order to enhance the heat transfer. The square shape silicon chip has a width of W=10 mm on each side. The length and diameter of the copper pin are L=20 mm and D=4 mm, respectively. During the operation, the surface of the chip, as well as the base of the pin, are maintained at the temperature of To=375 K. The thermal conductivity of the copper pin fin is...
4. An exothermic material is encased in a 1-m-long thin tubular sleeve. The material generates heat...
4. An exothermic material is encased in a 1-m-long thin tubular sleeve. The material generates heat at a steady rate of 4800 W/m. The thermal conductivity of the exothermic material is 22 W/mK. The radius of the tube is 30 cm, and you can neglect the thickness of the sleeve. Also assume the ends of the tube are perfectly insulated. (a) If the tube is exposed to air at 20°C, and if the convection coefficient between air and the tube...
Heat is uniformly generated at the rate of 2x 10W/m* in a wall of thermal conductivity...
Heat is uniformly generated at the rate of 2x 10W/m* in a wall of thermal conductivity 25 W/m-K and thickness 60 mm. The wall is exposed to convection on both sides, with different heat transfer coefficients and temperatures as shown. There are straight rectangular fins on the right-hand side of the wall, with dimensions as shown (L =20 mm) and thermal conductivity of 250 W/m-K. What is the maximum temperature that will occur in the wall? L tt-2 mm k=25...
8. An circular in of rectangular profile is attached to a circular tube having an outside...
8. An circular in of rectangular profile is attached to a circular tube having an outside diameter mm and a surface temperature of 250 °C. The finis 1 mm thick and 10 mm long and the temperature and the convection coefficient associated with the adioining fluid are 25 and 2 W/m .K, respectively. The thermal conductivity of the fin material may be assumed to W/m.ºc. ir fins are spaced at 5-mm increments: Determine the increase in heat transfer from the...
The heat that is conducted through a body must frequently be removed by other heat transfer...
The heat that is conducted through a body must frequently be removed by other heat transfer processes. For example, the heat generated in an electronic device must be dissipated to the surroundings through convection by means of fins. Consider the one-dimensional aluminum fin (thickness t 3.0 mm, width 20 cm, length L) shown in Figure 1, that is exposed to a surrounding fluid at a temperature T. The conductivity of the aluminum fin (k) and coefficient of heat convection of...
blem 4 (20 pts) A square chip that is 12.7mm on a side has a maximum allowable chip operating temperature -75°C. To dissipate heat produced in the chip, a 4 x 4 array of copper (k-400 W/m.K) pin fins is proposed to be etallurgically joined to the outer surface of the chip. The convection coefficient is h-250 W/m'K and ambient air mperature isTo-20°C. The pin fin dimeter is D,-1.5mm and length is L,-16mm. Assuming steady-state uniform chip temperature Te-75°C and...
4. A silicon chip is attached with a copper pin fin in order to enhance the heat transfer. The square shape silicon chip has a width of W=10 mm on each side. The length and diameter of the copper pin are L=20 mm and D=4 mm, respectively. During the operation, the surface of the chip, as well as the base of the pin, are maintained at the temperature of To=375 K. The thermal conductivity of the copper pin fin is...
4. A silicon chip is attached with a copper pin fin in order to enhance the heat transfer. The square shape silicon chip has a width of W=10 mm on each side. The length and diameter of the copper pin are L=20 mm and D=4 mm, respectively. During the operation, the surface of the chip, as well as the base of the pin, are maintained at the temperature of To=375 K. The thermal conductivity of the copper pin fin is...
4. A silicon chip is attached with a copper pin fin in order to enhance the heat transfer. The square shape silicon chip has a width of W=10 mm on each side. The length and diameter of the copper pin are L=20 mm and D=4 mm, respectively. During the operation, the surface of the chip, as well as the base of the pin, are maintained at the temperature of To=375 K. The thermal conductivity of the copper pin fin is...
4. An exothermic material is encased in a 1-m-long thin tubular sleeve. The material generates heat at a steady rate of 4800 W/m. The thermal conductivity of the exothermic material is 22 W/mK. The radius of the tube is 30 cm, and you can neglect the thickness of the sleeve. Also assume the ends of the tube are perfectly insulated. (a) If the tube is exposed to air at 20°C, and if the convection coefficient between air and the tube...
Heat is uniformly generated at the rate of 2x 10W/m* in a wall of thermal conductivity 25 W/m-K and thickness 60 mm. The wall is exposed to convection on both sides, with different heat transfer coefficients and temperatures as shown. There are straight rectangular fins on the right-hand side of the wall, with dimensions as shown (L =20 mm) and thermal conductivity of 250 W/m-K. What is the maximum temperature that will occur in the wall? L tt-2 mm k=25...
8. An circular in of rectangular profile is attached to a circular tube having an outside diameter mm and a surface temperature of 250 °C. The finis 1 mm thick and 10 mm long and the temperature and the convection coefficient associated with the adioining fluid are 25 and 2 W/m .K, respectively. The thermal conductivity of the fin material may be assumed to W/m.ºc. ir fins are spaced at 5-mm increments: Determine the increase in heat transfer from the...
The heat that is conducted through a body must frequently be removed by other heat transfer processes. For example, the heat generated in an electronic device must be dissipated to the surroundings through convection by means of fins. Consider the one-dimensional aluminum fin (thickness t 3.0 mm, width 20 cm, length L) shown in Figure 1, that is exposed to a surrounding fluid at a temperature T. The conductivity of the aluminum fin (k) and coefficient of heat convection of...
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