A fin array has 128 rectangular pin fins (0.0625 in x 0.125 in x 0.25 in)...
A fin array has 128 rectangular pin fins (0.0625 in x 0.125 in x 0.25 in) evenly spaced on a base 2 in x 2 in. The fins have conductivity k = 100 Btu/hr-ft-F , and are in an environment with h = 20 Btu/hr-ft2-F. What is the equivalent resistance of this fin array, in F-hr/Btu? Give your answer to three significant figures.
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A fin array has 128 rectangular pin fins (0.0625 in x 0.125 in x
0.25 in)...
hw FinFan fin efficiency Score: 0/5 0/1 answered Work saved Submit and End VO Question 1...
hw FinFan fin efficiency Score: 0/5 0/1 answered Work saved Submit and End VO Question 1 < > 0/5 pts 3 Details <p A horizontal tube-bundle air-cooled exchanger is used to condense steam at 255 F and has the following specifications: Tube Bundle: Steam is flowing inside the tubes tube od 1 in ; tube id 0.834 in ; tube pitch = 2 in (square pitch); k = 26 btu/ft-hr-F There are 18 tube rows with each row containing 72...
Lecture Assignment #7 A heat sink is composed of an array of rectangular fins. h-63 W/m-K...
Lecture Assignment #7 A heat sink is composed of an array of rectangular fins. h-63 W/m-K T 35°C a=2 mm b-2 mm FL-14 mm W-24 cm th, 0.75 cm k-35 W/m-K p 8200 kg/m The heat sink is square with base side dimension W 24 cm and base thickness ths- 0.75 cm. The fins are square and have side dimension a 2 mm and length L 14 mm. Fins are separated by a distance b 2 mm. (Note that there...
blem 4 (20 pts) A square chip that is 12.7mm on a side has a maximum allowable chip operating temperature -75°C. To dissipate heat produced in the chip, a 4 x 4 array of copper (k-400 W/m.K) pin fins...
blem 4 (20 pts) A square chip that is 12.7mm on a side has a maximum allowable chip operating temperature -75°C. To dissipate heat produced in the chip, a 4 x 4 array of copper (k-400 W/m.K) pin fins is proposed to be etallurgically joined to the outer surface of the chip. The convection coefficient is h-250 W/m'K and ambient air mperature isTo-20°C. The pin fin dimeter is D,-1.5mm and length is L,-16mm. Assuming steady-state uniform chip temperature Te-75°C and...
with an array of circular cross-section fins is used to cool a central processing the to...
with an array of circular cross-section fins is used to cool a central processing the to ensure that the temperature of the CPU surface remains at Te-1000. is placed directly on the CPU with a special thermal paste. The associated contact resistance 8. (15 Marks) A heat sink unit (CPU) which dissipates a maximum of 1680 [W] in heat. The heat sink is l-pase T and is square in shape (WcrUry32 mm x 32mm). The temperature 25 C. The circular...
hw FinFan fin efficiency Score: 0/5 0/1 answered Work saved Submit and End VO Question 1 < > 0/5 pts 3 Details <p A horizontal tube-bundle air-cooled exchanger is used to condense steam at 255 F and has the following specifications: Tube Bundle: Steam is flowing inside the tubes tube od 1 in ; tube id 0.834 in ; tube pitch = 2 in (square pitch); k = 26 btu/ft-hr-F There are 18 tube rows with each row containing 72...
Lecture Assignment #7 A heat sink is composed of an array of rectangular fins. h-63 W/m-K T 35°C a=2 mm b-2 mm FL-14 mm W-24 cm th, 0.75 cm k-35 W/m-K p 8200 kg/m The heat sink is square with base side dimension W 24 cm and base thickness ths- 0.75 cm. The fins are square and have side dimension a 2 mm and length L 14 mm. Fins are separated by a distance b 2 mm. (Note that there...
blem 4 (20 pts) A square chip that is 12.7mm on a side has a maximum allowable chip operating temperature -75°C. To dissipate heat produced in the chip, a 4 x 4 array of copper (k-400 W/m.K) pin fins is proposed to be etallurgically joined to the outer surface of the chip. The convection coefficient is h-250 W/m'K and ambient air mperature isTo-20°C. The pin fin dimeter is D,-1.5mm and length is L,-16mm. Assuming steady-state uniform chip temperature Te-75°C and...
with an array of circular cross-section fins is used to cool a central processing the to ensure that the temperature of the CPU surface remains at Te-1000. is placed directly on the CPU with a special thermal paste. The associated contact resistance 8. (15 Marks) A heat sink unit (CPU) which dissipates a maximum of 1680 [W] in heat. The heat sink is l-pase T and is square in shape (WcrUry32 mm x 32mm). The temperature 25 C. The circular...
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