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Part 2 - Problems (75 marks) I. Copper fins (k 401 W/mK) of uniform square cross-section...
G4 Problem Statement: Circular fins of uniform cross section, with diameter of 14 mm and length 7...
G4 Problem Statement: Circular fins of uniform cross section, with diameter of 14 mm and length 70 mm are attached to the wall with surface temperature o C. The fin is made of material with thermal conductivity of 210 W/mk, and exposed to an ambient air condition of 24 °C and the convection heat transfer coefficient of 190 W/m2k. f 300 1- Plot the temperature variation for the following boundary conditions a- Infinitely long fin b- Adiabatic fin tip c-...
blem 4 (20 pts) A square chip that is 12.7mm on a side has a maximum allowable chip operating temperature -75°C. To dissipate heat produced in the chip, a 4 x 4 array of copper (k-400 W/m.K) pin fins...
blem 4 (20 pts) A square chip that is 12.7mm on a side has a maximum allowable chip operating temperature -75°C. To dissipate heat produced in the chip, a 4 x 4 array of copper (k-400 W/m.K) pin fins is proposed to be etallurgically joined to the outer surface of the chip. The convection coefficient is h-250 W/m'K and ambient air mperature isTo-20°C. The pin fin dimeter is D,-1.5mm and length is L,-16mm. Assuming steady-state uniform chip temperature Te-75°C and...
4. A silicon chip is attached with a copper pin fin in order to enhance the...
4. A silicon chip is attached with a copper pin fin in order to enhance the heat transfer. The square shape silicon chip has a width of W=10 mm on each side. The length and diameter of the copper pin are L=20 mm and D=4 mm, respectively. During the operation, the surface of the chip, as well as the base of the pin, are maintained at the temperature of To=375 K. The thermal conductivity of the copper pin fin is...
4. A silicon chip is attached with a copper pin fin in order to enhance the...
4. A silicon chip is attached with a copper pin fin in order to enhance the heat transfer. The square shape silicon chip has a width of W=10 mm on each side. The length and diameter of the copper pin are L=20 mm and D=4 mm, respectively. During the operation, the surface of the chip, as well as the base of the pin, are maintained at the temperature of To=375 K. The thermal conductivity of the copper pin fin is...
4. A silicon chip is attached with a copper pin fin in order to enhance the...
4. A silicon chip is attached with a copper pin fin in order to enhance the heat transfer. The square shape silicon chip has a width of W=10 mm on each side. The length and diameter of the copper pin are L=20 mm and D=4 mm, respectively. During the operation, the surface of the chip, as well as the base of the pin, are maintained at the temperature of To=375 K. The thermal conductivity of the copper pin fin is...
2. Straight metal fins (k = 100 W/m°C) with rectangular profile protrude from a l m...
2. Straight metal fins (k = 100 W/m°C) with rectangular profile protrude from a l m high wall. The wall is maintained at 200 °C and exposed to a convection environment at 25°C with h = 20 W/m² °C. The fins have a length (L) of 8 cm and a thickness (1) of 3 mm. The space between two adjacent fins is 2 mm. Calculate the following for per unit depth of wall: (a) the fin efficiency, (8 points) (b)...
with an array of circular cross-section fins is used to cool a central processing the to...
with an array of circular cross-section fins is used to cool a central processing the to ensure that the temperature of the CPU surface remains at Te-1000. is placed directly on the CPU with a special thermal paste. The associated contact resistance 8. (15 Marks) A heat sink unit (CPU) which dissipates a maximum of 1680 [W] in heat. The heat sink is l-pase T and is square in shape (WcrUry32 mm x 32mm). The temperature 25 C. The circular...
1) 2) 3) PROJECT #1 (2.5 Marks): The heat that is conducted through a body must...
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PROJECT #1 (2.5 Marks): The heat that is conducted through a body must frequently be removed by other heat transter processes. For example, the heat generated in an electronic device must be dissipated to the surroundings through convection by means of fins. Consider the one-dimensional aluminum fin (thickness t 3.0 mm, width Z 20 cm, length L) shown in Figure 1, that is exposed to a surrounding fluid at a temperature 1. The conductivity of the aluminum...
G4 Problem Statement: Circular fins of uniform cross section, with diameter of 14 mm and length 70 mm are attached to the wall with surface temperature o C. The fin is made of material with thermal conductivity of 210 W/mk, and exposed to an ambient air condition of 24 °C and the convection heat transfer coefficient of 190 W/m2k. f 300 1- Plot the temperature variation for the following boundary conditions a- Infinitely long fin b- Adiabatic fin tip c-...
blem 4 (20 pts) A square chip that is 12.7mm on a side has a maximum allowable chip operating temperature -75°C. To dissipate heat produced in the chip, a 4 x 4 array of copper (k-400 W/m.K) pin fins is proposed to be etallurgically joined to the outer surface of the chip. The convection coefficient is h-250 W/m'K and ambient air mperature isTo-20°C. The pin fin dimeter is D,-1.5mm and length is L,-16mm. Assuming steady-state uniform chip temperature Te-75°C and...
4. A silicon chip is attached with a copper pin fin in order to enhance the heat transfer. The square shape silicon chip has a width of W=10 mm on each side. The length and diameter of the copper pin are L=20 mm and D=4 mm, respectively. During the operation, the surface of the chip, as well as the base of the pin, are maintained at the temperature of To=375 K. The thermal conductivity of the copper pin fin is...
4. A silicon chip is attached with a copper pin fin in order to enhance the heat transfer. The square shape silicon chip has a width of W=10 mm on each side. The length and diameter of the copper pin are L=20 mm and D=4 mm, respectively. During the operation, the surface of the chip, as well as the base of the pin, are maintained at the temperature of To=375 K. The thermal conductivity of the copper pin fin is...
4. A silicon chip is attached with a copper pin fin in order to enhance the heat transfer. The square shape silicon chip has a width of W=10 mm on each side. The length and diameter of the copper pin are L=20 mm and D=4 mm, respectively. During the operation, the surface of the chip, as well as the base of the pin, are maintained at the temperature of To=375 K. The thermal conductivity of the copper pin fin is...
2. Straight metal fins (k = 100 W/m°C) with rectangular profile protrude from a l m high wall. The wall is maintained at 200 °C and exposed to a convection environment at 25°C with h = 20 W/m² °C. The fins have a length (L) of 8 cm and a thickness (1) of 3 mm. The space between two adjacent fins is 2 mm. Calculate the following for per unit depth of wall: (a) the fin efficiency, (8 points) (b)...
with an array of circular cross-section fins is used to cool a central processing the to ensure that the temperature of the CPU surface remains at Te-1000. is placed directly on the CPU with a special thermal paste. The associated contact resistance 8. (15 Marks) A heat sink unit (CPU) which dissipates a maximum of 1680 [W] in heat. The heat sink is l-pase T and is square in shape (WcrUry32 mm x 32mm). The temperature 25 C. The circular...
1)
2)
3)
PROJECT #1 (2.5 Marks): The heat that is conducted through a body must frequently be removed by other heat transter processes. For example, the heat generated in an electronic device must be dissipated to the surroundings through convection by means of fins. Consider the one-dimensional aluminum fin (thickness t 3.0 mm, width Z 20 cm, length L) shown in Figure 1, that is exposed to a surrounding fluid at a temperature 1. The conductivity of the aluminum...
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