(10) Explain the functions of the metals in metal contacts and
interconnect vias (via plugs) in
advanced semiconductor devices with multiple metal layers.
In advance semiconductor devices metal contact is used at the junction of different layeres to increase the switching frequency of the devices. We know that the switching frequency mainly depends Upton the turn Off time of the device which inturn depends upon the excess charge carrier at the junction. Now when the junction is short with metals the recombination time (for excess charge carrier) becomes almost zero therefore trun off time is reduced which increases the switching frequency of the device.
(10) Explain the functions of the metals in metal contacts and interconnect vias (via plugs) in...
1-It is desired to make metal / semiconductor rectifier contact with \(\mathrm{N}_{\mathrm{D}}=2 \times 10^{17} \mathrm{~cm}^{-3}\) doped silicon, which of the metals whose work functions are given below you can use. Explain by making the necessary calculations. Find the barrier heights on the Metal and Semiconductor side. Find the depletion width. Electron affinity of Si \(\chi=4 \mathrm{eV},\) Work function of metals \(\emptyset(\mathrm{Al})=4.3 \mathrm{eV}, \emptyset(\mathrm{Mg})=3.7 \mathrm{eV}\), \(\Phi(\mathrm{Pt})=5.65 \mathrm{eV}, \emptyset(\mathrm{Zn})=4.47 \mathrm{eV}, \emptyset(\mathrm{Au})=5.1 \mathrm{eV}, \mathrm{n}_{1}(\mathrm{Si})=1.5 \times 10^{10}\)