Homework Answers
A power MOSFET in a DC-DC converter must sustain power loss of 30 W. The device is manufactured 1. in a TO-220 package,...
A power MOSFET in a DC-DC converter must sustain power loss of 30 W. The device is manufactured 1. in a TO-220 package, with Ric-1.2 K/W, and Trmax)-150。C. The manufacturer reports that without a heat sink, the approximate value of Ria is 45 K/W. a) Can the power loss value be handled without a heat sink? b) If not, assume Res 1.0 K/W and design a specification for Rso to meet the maximum junction temperature requirement if ambient temperature is...
A power MOSFET in a DC-DC converter must sustain power loss of 30 W. The device is manufactured in a TO-220 package, wi...
A power MOSFET in a DC-DC converter must sustain power loss of 30 W. The device is manufactured in a TO-220 package, with Ric-1.2K/W, and Trma,-150 ℃ The manufacturer reports that without a heat sink, the approximate value of Ria is 45 K/W a) Can the power loss value be handled without a heat sink? b) If not, assume Rcs 1.0 K/W and design a specification for Rsa to meet the maximum junction temperature requirement if ambient temperature is 25...
Given: A MOSFET is used in a switching power-pole found in Fig. 2-4a of the text....
Given: A MOSFET is used in a switching power-pole found in Fig. 2-4a of the text. The operating conditions are as follows: Vin 35V, 6 A, the switching frequency fs 300 kHz, and the duty ratio d 0.4 a) Consider the diode in the power pole. Assuming an offset voltage forward bias model of the free-wheeling diode in which VM 1.2 V, calculate the average forward power loss in the diode HINT: Consider Eq. 2A-1 b) In the diode reverse...
20. The LM317 has a maximum operating temperature of 125°C. The TO-220 case version shows a...
20. The LM317 has a maximum operating temperature of 125°C. The TO-220 case version shows a thermal resistance of 4 C°/W, junction to case. It also shows 50 C°/W, junction to ambient (no heat sink used). Assuming an ambient temperature of 50°C. What is the maximum allowable power dissipation for each setup? Assume that the first version uses a 15 C°/W heat sink with a 2 C°/W case to heat sink interconnection. Please and Thank You
QUESTION 4(Total 12.5 Marks) The switch current and voltage waveforms of a power converter are shown in the next page....
QUESTION 4(Total 12.5 Marks) The switch current and voltage waveforms of a power converter are shown in the next page. The switch has a maximum junction temperature, T,max140°C and a junction-to-case thermal resistance Rc 0.55°C/w (a) How much power is dissipated by the switch? Sketch the power waveform (7.5 marks) (b) The converter operates in an ambient of 25°C and the switch is mounted on a heat sink. Specify the value of thermal resistance of the heat sink, if a...
of a) What are the sources of losses for semiconductors devices? (2 Marks) b) A thyristor...
of a) What are the sources of losses for semiconductors devices? (2 Marks) b) A thyristor with a steady power loss of 300 has a junction to heatsink thermal resistance of 0.7°C/W. Determine the maximum value of the thermal resistance the heatsink can have if the ambient temperature is or and the junction temperature is limited to 125 C. Give the heatsink femperature at these conditions. Marks) c) The thyristor in the switching circuit of following figure has rating of...
1. Calculate the dissipated power on the regulator and what the junction temperature does the regulator...
1. Calculate the dissipated
power on the regulator and what the junction temperature does the
regulator will go up without heatsink? Assume +5V regulator run at
load current 600mA and ambient temperature is 25 °C.
2. Calculate the thermal resistance sink to ambient if you think
that you need a heatsink for the regulator. Assume the thermal
resistance for thermal interface material is 0.16 °C/W and the
maximum ambient temperature of 45°C.
3. Calculate the thermal resistance sink to ambient....
For a Mosfet, power loss measurement in time is given below. Pdm is 150W. Thermal impedance...
For a Mosfet, power loss measurement in time is given below. Pdm is 150W. Thermal impedance characteristics of the MOSFET is also shown below figure. tl and T are 1 usecond and 5 u second respectively. The case temperature is measured as 95 C. What is the peak junction temperature respecting the case temperature? Pm 0 t1 T 10 D-0.50 1 Thermal Response (Zuc) 0.1 R R, 0.20 0.10 0.05 0.02 0.01 с 2 0.01 Ri(°C/W) i (sec) 0.371 0.000272...
Ctri fellowing problems wil refer to the description and diagram below. Heat sink Top View Square...
Ctri fellowing problems wil refer to the description and diagram below. Heat sink Top View Square fins Heat sink Interface, Ls Heat spreader Chip You are tasked with designing the heat sink for a silicon chip (k = 50W/m·K) with a thickness of le = 3 mm and a thermal design power of Q.-130 w, meaning that at maximum operation, the heatsink must dissipate 130 W of power. In your initial design, a heat spreader of thickness 3 mm, made...
4.25 An aluminum heat sink (k 230 W/m - K), used to cool an array of...
4.25 An aluminum heat sink (k 230 W/m - K), used to cool an array of electronic chips, consists of a square chan nel of inner width w -30 mm, through which liquid flow may be assumed to maintain a uniform surface tem perature of T 20°C. The outer width and length of the channel are W= 40 mm and L = 160 mm, respectively. Chip, T RiC Heat sink T. 2 T1 Coolant If N 120 chips attached to...
A power MOSFET in a DC-DC converter must sustain power loss of 30 W. The device is manufactured 1. in a TO-220 package, with Ric-1.2 K/W, and Trmax)-150。C. The manufacturer reports that without a heat sink, the approximate value of Ria is 45 K/W. a) Can the power loss value be handled without a heat sink? b) If not, assume Res 1.0 K/W and design a specification for Rso to meet the maximum junction temperature requirement if ambient temperature is...
A power MOSFET in a DC-DC converter must sustain power loss of 30 W. The device is manufactured in a TO-220 package, with Ric-1.2K/W, and Trma,-150 ℃ The manufacturer reports that without a heat sink, the approximate value of Ria is 45 K/W a) Can the power loss value be handled without a heat sink? b) If not, assume Rcs 1.0 K/W and design a specification for Rsa to meet the maximum junction temperature requirement if ambient temperature is 25...
Given: A MOSFET is used in a switching power-pole found in Fig. 2-4a of the text. The operating conditions are as follows: Vin 35V, 6 A, the switching frequency fs 300 kHz, and the duty ratio d 0.4 a) Consider the diode in the power pole. Assuming an offset voltage forward bias model of the free-wheeling diode in which VM 1.2 V, calculate the average forward power loss in the diode HINT: Consider Eq. 2A-1 b) In the diode reverse...
QUESTION 4(Total 12.5 Marks) The switch current and voltage waveforms of a power converter are shown in the next page. The switch has a maximum junction temperature, T,max140°C and a junction-to-case thermal resistance Rc 0.55°C/w (a) How much power is dissipated by the switch? Sketch the power waveform (7.5 marks) (b) The converter operates in an ambient of 25°C and the switch is mounted on a heat sink. Specify the value of thermal resistance of the heat sink, if a...
of a) What are the sources of losses for semiconductors devices? (2 Marks) b) A thyristor with a steady power loss of 300 has a junction to heatsink thermal resistance of 0.7°C/W. Determine the maximum value of the thermal resistance the heatsink can have if the ambient temperature is or and the junction temperature is limited to 125 C. Give the heatsink femperature at these conditions. Marks) c) The thyristor in the switching circuit of following figure has rating of...
1. Calculate the dissipated
power on the regulator and what the junction temperature does the
regulator will go up without heatsink? Assume +5V regulator run at
load current 600mA and ambient temperature is 25 °C.
2. Calculate the thermal resistance sink to ambient if you think
that you need a heatsink for the regulator. Assume the thermal
resistance for thermal interface material is 0.16 °C/W and the
maximum ambient temperature of 45°C.
3. Calculate the thermal resistance sink to ambient....
For a Mosfet, power loss measurement in time is given below. Pdm is 150W. Thermal impedance characteristics of the MOSFET is also shown below figure. tl and T are 1 usecond and 5 u second respectively. The case temperature is measured as 95 C. What is the peak junction temperature respecting the case temperature? Pm 0 t1 T 10 D-0.50 1 Thermal Response (Zuc) 0.1 R R, 0.20 0.10 0.05 0.02 0.01 с 2 0.01 Ri(°C/W) i (sec) 0.371 0.000272...
Ctri fellowing problems wil refer to the description and diagram below. Heat sink Top View Square fins Heat sink Interface, Ls Heat spreader Chip You are tasked with designing the heat sink for a silicon chip (k = 50W/m·K) with a thickness of le = 3 mm and a thermal design power of Q.-130 w, meaning that at maximum operation, the heatsink must dissipate 130 W of power. In your initial design, a heat spreader of thickness 3 mm, made...
4.25 An aluminum heat sink (k 230 W/m - K), used to cool an array of electronic chips, consists of a square chan nel of inner width w -30 mm, through which liquid flow may be assumed to maintain a uniform surface tem perature of T 20°C. The outer width and length of the channel are W= 40 mm and L = 160 mm, respectively. Chip, T RiC Heat sink T. 2 T1 Coolant If N 120 chips attached to...
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