Question

Ctri fellowing problems wil refer to the description and diagram below. Heat sink Top View Square fins Heat sink Interface, Ls Heat spreader Chip You are tasked with designing the heat sink for a silicon chip (k = 50W/m·K) with a thickness of le = 3 mm and a thermal design power of Q.-130 w, meaning that at maximum operation, the heatsink must dissipate 130 W of power. In your initial design, a heat spreader of thickness 3 mm, made of tungsten (k = 175 w/m-K), is placed between the chip and the heat sink. There is no thermal contact resistance between the chip and the heat spreader. Between the heat spreader and the heat sink is an interface with a thermal contact resistance of Re=5×10-6 m2-K/W" The aluminum heat sink (k = 200 W/m·K) has a base thickness of Lb-3 mm, and fin length of L,-6mm. There are N = 144 square fins, each of width w = 1 mm, and with spacing of S = 2 mm as shown. Cooling is accomplished using a dielectric liquid with To.-25°C and h = 1500W/m2 . K. The chip, heat spreader, and heatsink are all square, with a width of = 23 mm.

Answer 1

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