Aluminum is diffused into a wafer of single crystal high purity silicon at a temperature of...
4. Arsenic is diffused into a thick slice of silicon with no previous arsenic in it at 1100°C. If the surface concentration of the arsenic is 5.0 x 1018 atoms/cm and its concentration at 1.2 um below the silicon surface is 1.5 x 1016 atoms/cm', how long must the diffusion time be? (D = 3.0 x 10-14 cm°/s for As diffusing in Si at 1100°C.)
Please finish these questions. Thank you 1. The surface of a silicon wafer has a region that is uniformly doped with boron at a concentration of 1018cm3. This layer is 20Å thick (1A 104um). The entire wafer, including this region, is uniformly doped with arsenic at a concentration of 1015cm2 The surface of the wafer is sealed and it is heated at 1000° C for 30 min. Assume Do 0.037 cm2/s and EA-3.46eV for Boron in a silicon lattice at...
(a) Silicon wafers can be made p-doped by diffusing boron into the wafer. If Boron is diffused at 1100 °C for 5 hours. Using the diffusion equation below: dx with J is the particle flux (in cm2s1), n is the particle density (in cm-3) and D is the diffusion constant (in cm2.s1). If the concentration of Boron at the surface is 1018 cm-3, calculate the depth below the surface at which the concentration is 1017 cm-3. The Boron diffusion flux...
3. Doping of Silicon One method of introducing dopant impurities into silicon (so as to control the electronic properties) is to depos a in layer on the surface and allow the impurity to diffuse in at a high temperature. Suppose we vapor deposit a thin layer of boron that has 2 x 1015 atoms/cm2 on the surface of a pure silicon wafer, and anneal the wafer for three hours at 1200 C. To about what depth will the boron concentration...
Problem 8 A silicon wafer is doped by Phosphorous via Diffusion at 1090°c. TCC) 1200 1000 Gaussian function. The solid solubility of phosphorous is 10 cm and the measured junction depth is 1 um at a substrate concentration of 106 cm 3. Calculate the diffusion time and the total dopant in the diffused layer. Si Cu Au Slope for E,- 1 ev 2 eV 3 eV t ev 5 eV 10-12 Al In 0.6 0.7 1000T (K-)
Problem 3: A large block of high purity aluminum is placed in contact with magnesium. The materials are heated to 500°C and held at that temperature for 24 hours. What is the concentration of magnesium at a depth of 500 um into the aluminum at the end of this heat treatment? The density of magnesium is 1.74 gm/cm, respectively. At 500°C the Arrhenius parameters for the diffusion of Mg into Al are: D.= 1.2x10° (mº/s) Q = 131 kJ/mol
A large block of high purity aluminum is placed in contact with magnesium. The materials are heated to 500°C and held at that temperature for 24 hours. What is the concentration of magnesium at a depth of 500 µm into the aluminum at the end of this heat treatment? The density of magnesium is 1.74 gm/cm3, respectively. At 500°C the Arrhenius parameters for the diffusion of Mg into Al are: Do= l.2xl0-4 (m2/s) Q = 131 kJ/mol
13.0 (50 pts) Consider the high temperature diffusion of Aluminum at 1368°C for 360 hours into a semi-infinite solid cylinder of pure silicon having a radius R=520 E-6 m. Assume values of Do = 8.968 cm2/s, Q = 333.5 kJ/mole, R = 8.314 J/mole-K and a surface concentration 4E20 atoms/cm3. Determine the concentration at the ten (10) equally spaced distances from the surface listed below. Report concentrations in atom/cu.cm. _4E+20 Casurface a) b) c) d) e) f) g) h) i)...