A 15-mm × 15-mm silicon chip is mounted such that the edges are flush in a substrate. The chip dissipates 1.4 W of power uniformly, while air at 20°C (1 atm) with a velocity of 25 m/s is used to cool the upper surface of the chip. If the substrate provides an unhealed starting length of 15 mm, determine the surface temperature at the trailing edge of the chip. Evaluate the air properties at 50°C.
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