A 20 mm × 20 mm silicon chip is mounted such that the edges are flush in a substrate. The substrate provides an unhealed starting length of 20 mm that acts as turbulator. Airflow at 25°C (1 atm) with a velocity of 25 m/s is used to cool the upper surface of the chip. If the maximum surface temperature of the chip cannot exceed 75°C. determine the maximum allowable power dissipation on the chip surface.
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