Subject :
Semiconductor
topic MOS
Subject : Semiconductor topic MOS + 1. Figure 1 illustrates the energy band diagram of a...
Problem 6: The energy band diagram for an ideal MOS-capacitor is shown below. tx 0.2 μm and Ep = E, at the Si-SiO2 interface. Assume no oxide charge and φ'm5-0. Answer the following. EpM Eps Toz9ev 055ev a) What is the numerical value of the electron concentration at the Si-SiO2 interface? b) What is the substrate doping type and concentration? c) What is the electrostatic potential at the Si-SiO2 interface? d) What would be the depletion depth (width)? e) What...
Problem3: Consider a MOS capacitor maintained at T 300K with the following characteristics: Assume Esi 1.9,x 3.9,8.85 x 10-14 F/cm, and n 1.5 x 1010cm3 . Gate material is n+ poly-silicon . Total negative oxide charge of 5x 1011q C/cnm2 . Substrate is n-type Si, with doping concentration 1x1016 cm3 Oxide thickness 5 nm . The electron affinity for Si is 4.03eV? a) Draw the band diagram at equilibrium. b) From part (a). What is the substrate (bulk) condition at...
Need help with i) please! 2. The energy band diagram for an ideal xo-0.2um MOS-C operated at T-300K is sketched in Figure 1. Note that the applied gate voltage causes band bending in the semiconductor such that Ef Ei at the Si-SiO2 interface. a) Sketch the electrostatic potential () inside the semiconductor as a function of position b) Roughly sketch the electric field (5) inside the oxide and semiconductor as a function of position. c) Do equilibrium conditions prevail inside...
Please do d e and f (15 pts) 14. The energy band diagram for an ideal MOS-C under a specific gate bias is shown below. The device is maintained at T 300 K, kTiq 0.026 V, n, 1010 cm Note that E EF at the surface of the semiconductor. Answer the following questions. (d) Determine the surface potential s. (3 pts) EFM 0.24eVEc (e) Determine Dr. (3 pts) E, 0437 ev Ev 0 (a) What biasing mode is this MOS-C...
Problem 3 (25 points) Consider a MOS capacitor with p polysilicon gate and p-type silicon substrate with NA 1016 cm3. Ef- Ev in the polysilicon gate. Assume the following parameters: I200A, , 1.5x10° cm*,E, -3.9x8.854x104FIcm ox a) (5 points) Calculate the metal-semiconductor work function difference. b) (5 points) Calculate the surface potential at the threshold inversion. c) (5 points) Calculate the depletion width (in μm) at the threshold inversion. d) (5 points) Calculate the flat band voltage. e) (5 points)...
Problem 3: Consider a MOS capacitor maintained at T= 300K with the following characteristics: Assume s 11.9, ox 3.9, 8.85x 10-1 F/cm, and n 1.5 x 1010cm3 Gate material is n poly-silicon Total negative oxide charge of 5x 1011q C/cm . Substrate is n-type Si, with doping concentration 1 x1016 cm-3 Oxide thickness 5 nmm The electron affinity for Si is 4.03eV? e) What is the flat capacitance? f) What is the depletion region width? g) What is the potential...
Consider an n-channel Silicon MOS system with a substrate resistivity of 10 0-cm and with a polycrystalline gate. Assume that the polysilicon gate is doped with boron atoms to a density of 1x1019 cm and that the silicon dioxide is 50 nm-thick. The channel is not biased except from the gate (Vc= VB = 0). (i) Accurately sketch the band diagram identifying flatband voltage, surface potential at inversion, depletion width at inversion, and charges at inversion. Tabulate these parameters. (ii)...
For a MOS-structure with an n-type Si, (a) estimate the inversion voltage onset assuming that the flat band condition is Vo 0.5V and draw the corresponding energy band diagram. (b) Using ND 5*1017 cm3, calculate thickness of the depletion region under applied 1V bias (assume depletion mode) (c) For the same MOS structure, sketch a C-V curve and (d) calculate high-frequency maximum and minimum capacitances assuming metal contact area of 10 um2 and Si thickness of 500A (SiO2 dielectric constant...
Problem 1. An n-channel MOS transistor is fabricated with the following specifications: Substrate is a p-type silicon with doping concentration NA=2x1015 cm-3 . The SiO2 gate thickness is 200 Å. Effective interface charges Qi=6.5x10-9 col/cm2. Work function difference between gate conductor and silicon substrate qфms=-0.95 eV. Calculate the following: a. Maximum depletion width, with respect to ground b. Gate capacitance per unit area, Ci c. Flat-band voltage, VFB d. Threshold voltage, VT.
Question 2 A metal-semiconductor junction has barrier potential height of 1.265 V. The semiconductor is uniformly doped with 1015 cm-3 Phosphorus and the other parameters are as listed below. a) Derive the electric field distribution, E as a function distance, x at thermal equilibrium. The metal-semiconductor interface is defined as x=0. State the boundary condition used. b) Derive the potential distribution, V as a function of distance, x under thermal equilibrium. Determine the potentials at the metal-semiconductor interface (x=0) and...