Q1
Which of the following is true for a MOS capacitor with a P-type body?
Select one:
a. The charge in the inversion layer stays approximately constant as the gate voltage is increased above the threshold voltage
b. The charge in the depletion region is proportional to the square root of the depletion region width, assuming that the body is uniformly doped
c. In inversion, the total charge is equal to the sum of the charge in the depletion region plus the charge in the accumulation layer
d. In both inversion and accumulation, the charge varies nonlinearly with the gate voltage, like a reverse-biased PN junction capacitor
e. None of these
Q2
The capacitance of a MOS capacitor in strong inversion is larger when measured at high frequencies than at low frequencies, because at low frequencies there is enough time for generation to supply carriers to the inversion layer.
Select one:
True
False
Q3 What is the threshold voltage in millivolts for a MOS capacitor with an N+ polysilicon gate and an N-type body doped with phosphorus at a concentration of 4.6 x 10^16/cm^3? Assume that the oxide thickness is 68.4 angstroms. Use: kT/q = 26mV and ni = 1.5 x 10^10/cm^3 at 300°K, εs = 11.7, εox = 3.9, ε0 = 8.854 x 10^-14 F/cm, and q = 1.6 x 10^-19 C. Assume that the intrinsic Fermi level, Ei, is in the middle of the band-gap. For this question, be sure to give your answer to the nearest millivolt!
Q4
Which of the following is true about the effective gate oxide thickness, Toxe ?
Select one:
a. It is approximately the same as the physical oxide thickness in newer processes with thinner gate oxides
b. It is significantly different than the physical oxide thickness in older processes with thicker gate oxides
c. It includes the effect of the inversion layer thickness not being equal to zero
d. None of these
e. It includes the effect of the depletion layer thickness in the silicon body
Q5
Sodium contamination is everywhere, and so must be completely eliminated by process engineers in order to avoid shifts in the MOS threshold voltage.
Select one:
True
False
Q6
For an NMOS FET biased with Vgs > Vt and Vds > Vdsat, which of the following is true?
Select one:
a. None of these
b. The voltage from the source to the end of the channel near the drain increases as Vds increases
c. The channel is pinched off near the drain end
d. The channel-to-body voltage is smaller at the drain end of the channel than at the source end
e. The gate-to-channel voltage is smaller at the source end of the channel than at the drain end
Q7
Since Nonvolatile (Flash) Memory cells only use standard CMOS transistors, flash memory can be used on any chip without the need to modify the CMOS process.
Select one:
True
False
Q8 What is the surface mobility of electrons in cm^2/Vs for an NMOS FET with an effective oxide thickness, Toxe, of 71 angstroms and a threshold voltage, Vt, of 0.2V when this transistor is operating with Vgs = 1.5V ?
Q9
For an NMOS FET biased with Vgs > Vt and Vds > Vdsat, which of the following is true?
Select one:
a. The channel-to-body voltage is smaller at the source end of the channel than at the drain end
b. The gate-to-channel voltage is smaller at the source end of the channel than at the drain end
c. The channel extends all the way from the source to the drain
d. All of these
e. The voltage from the source to the end of the channel near the drain increases as Vds increases
Q10
For MOSFETs with very short channels, the maximum current that can flow is limited by the thermal velocity of carriers in the drain.
Select one:
True
False
The answers for the following questions are
1. In inversion, the total charge is equal to the sum of the charge in the depletion region plus the charge in the accumulation layer
2. false
3.
4. It is significantly different than the physical oxide thickness in older processes with thicker gate oxides \
5. false
6. The gate-to-channel voltage is smaller at the source end of the channel than at the drain end
7. true
8. 3
9. The gate-to-channel voltage is smaller at the source end of the channel than at the drain end
10. true
Q1 Which of the following is true for a MOS capacitor with a P-type body? Select...
1.24P)a) Plot the structure of p-channel MOS-FET (Show semiconductor structure, gate, drain, source and voltage polarities) and summarize the working principle. b) Explain what happens if you change drain source voltage polarity. c) Plot the band diagram, approximate distributions of charge, electric field, and electrostatic potential in the ideal MOS capacitor in inversion for the p-channel case.
1.24P)a) Plot the structure of p-channel MOS-FET (Show semiconductor structure, gate, drain, source and voltage polarities) and summarize the working principle. b) Explain what happens if you change drain source voltage polarity. c) Plot the band diagram, approximate distributions of charge, electric field, and electrostatic potential in the ideal MOS capacitor in inversion for the p-channel case.
Q1 Which of the following is true about the surface mobility of MOSFETs ? Select one: a. Surface mobility goes up as electric field strength increases b. Surface mobility stays the same when silicon is put under mechanical stress c. Surface mobility is the same regardless of the surface orientation of the silicon crystal d. None of these e. Surface mobility is higher for holes than it is for electrons Q2 What is the drain current in microamps for an...
Consider an n-channel Silicon MOS system with a substrate resistivity of 10 0-cm and with a polycrystalline gate. Assume that the polysilicon gate is doped with boron atoms to a density of 1x1019 cm and that the silicon dioxide is 50 nm-thick. The channel is not biased except from the gate (Vc= VB = 0). (i) Accurately sketch the band diagram identifying flatband voltage, surface potential at inversion, depletion width at inversion, and charges at inversion. Tabulate these parameters. (ii)...
A MOS capacitor is made on n-type silicon with oxide thickness of 50 A, a positive interface charge of 5 x 1010 cm2 and a uniform positive oxide charge of density p- 2 x 106 cm3 throughout the oxide. The substrate is doped with Na-101" cm3 and the gate is polysilicon doped with boron just to the edge of degeneracy (p+ poly, Ef -Ev). a. Calculate the flat band voltage VB and the threshold voltage Vr b. Sketch the charge...
The ID–VDS of a 1980s vintage (but “ideal”) N-MOSFET is shown in the figure. The VT = 1 V, tox = 100 nm (SiO2) and the source is grounded. (a) What regions of operation do points (1), (2), and (3) correspond to? (b) What is the applied gate voltage? (c) What is the inversion charge density (in electrons per cm2) at the source end of the channel, n(y = 0), and at the drain end of the channel, n(y =...
Problem 3: Consider a MOS capacitor maintained at T= 300K with the following characteristics: Assume s 11.9, ox 3.9, 8.85x 10-1 F/cm, and n 1.5 x 1010cm3 Gate material is n poly-silicon Total negative oxide charge of 5x 1011q C/cm . Substrate is n-type Si, with doping concentration 1 x1016 cm-3 Oxide thickness 5 nmm The electron affinity for Si is 4.03eV? e) What is the flat capacitance? f) What is the depletion region width? g) What is the potential...
(3 pts) 8. Consider an n-channel MOSFET, which is essentially a MOS capacitor with two p-n junctions placed immediately adjacent to the region of the semiconductor controlled by the MOS gate. What must be the biasing mode of the MOS structure and polarity of the gate voltage for there to be a measurable current? a. Enhancement, positive b. Inversion, negative c. Inversion, positive d. Depletion, negative
Problem3: Consider a MOS capacitor maintained at T 300K with the following characteristics: Assume Esi 1.9,x 3.9,8.85 x 10-14 F/cm, and n 1.5 x 1010cm3 . Gate material is n+ poly-silicon . Total negative oxide charge of 5x 1011q C/cnm2 . Substrate is n-type Si, with doping concentration 1x1016 cm3 Oxide thickness 5 nm . The electron affinity for Si is 4.03eV? a) Draw the band diagram at equilibrium. b) From part (a). What is the substrate (bulk) condition at...
Problem 1: The MOSFET as a Resistor Consider an n -poly-Si-gated long-channel n-MOSFET with WIL- 10, effective gate- oxide thickness Toxe 2 nm, and substrate (body) dopant concentration NA- 1018 cm3: (a) Calculate the gate-to-source voltage VGs required for the MOSFET to present a resistance of 1 kΩ between the source and drain at low values of VDS. (Hint: You will need to solve this problem iteratively when you consider the dependence of effective mobility leff on the effective vertical...